Sources
Where the numbers come from
Vendor and foundry figures are claims made by those companies. Roadmap dates move; check the primary source before relying on a date or specification.
- TSMC, 2026 North America Technology Symposium (A13, A12, N2U, CoWoS, SoIC, COUPE)
- Semiconductor Engineering, TSMC Tech Symposium 2026 by the numbers
- Tom's Hardware, TSMC A14
- Seoul Economic Daily, TSMC completes A16 (Aug 2026)
- NVIDIA Developer, Inside the Vera Rubin platform
- NVIDIA, Vera Rubin NVL72
- Tom's Hardware, Blackwell Ultra B300
- Tom's Hardware, AMD MI455X and Helios
- StorageReview, MI455X 432 GB HBM4
- Google, Ironwood: the first TPU for the age of inference
- Wccftech, Google Ironwood TPU
- TechPowerUp, Panther Lake teardown
- Tom's Hardware, Intel roadmap 2026–2028
- TrendForce, imec High-NA EXE:5200
- EE Times, The state of HBM4 at CES 2026
- SemiAnalysis, ISSCC 2026
- TrendForce, TSMC COUPE 2026
- Nature, A RISC-V 32-bit microprocessor based on 2D semiconductors (2025)
- Nature, Computer processors built from 2D materials (2025)
- Nature Communications, Wafer-scale 2D MoS₂ transistors, sub-5 nm channel (2026)
- Nature, Universal photonic artificial intelligence acceleration (2025)
- Google DeepMind, How AlphaChip transformed chip design
- CACM, Updates spark uproar (AlphaChip critique)
- arXiv:2411.10053, That Chip Has Sailed
- arXiv:2606.28279, Agentic hardware design as repository-level code evolution
- arXiv:2506.14074, CVDP benchmark
- arXiv:2606.17253, PDAGENT-BENCH
- arXiv:2601.21448, ChipBench
- arXiv:2503.22476, The 2D Materials Roadmap
- Tom's Hardware, imec 2026 roadmap
- TrendForce, TSMC 2 nm prices up 10–20%
- Tom's Hardware, A16 wafer price rumour
- Tom's Hardware, N2 SRAM scaling
- Semiconductor Engineering, VLSI 2026: Intel 18A
- TechInsights, Intel PowerVia
- SemiAnalysis, Inside the 800 VDC revolution
- Vertiv, The 800 VDC decision
- TechArena, OCP Global Summit 2026
- gr1d, 800 VDC data centres and Vera Rubin
- Live Science, Microsoft microfluidic cooling
- Epoch AI, Huawei's roadmap to 2031
- CFR, China's AI chip deficit
- Huawei, SuperPoD interconnect keynote (Atlas 950)
- Tom's Hardware, Huawei AI-chip revenue
- TechPowerUp, CXMT HBM3E by end of 2026
- Tom's Hardware, CXMT HBM3E risk production
- Economy.ac, CXMT HBM3E at 20–30% yield
- ChinaTalk, Mapping China's HBM advances
- Tom's Hardware, Synopsys AgentEngineer
- Tom's Hardware, Agentic AI in EDA tools 2026
- Optimizing Deep Learning Models on GPUs (full guide on this site) · PDF
- UCIe Consortium, UCIe 3.0 specification (Aug 2025)
- Synopsys, The road to 64G UCIe IP
- eeNews, NVIDIA opens NVLink for chiplets
- SDxCentral, Ayar Labs joins NVLink Fusion
- TrendForce, Top-10 foundries 2Q26
- Counterpoint, Global foundry market share
- DigiTimes, Rapidus targets 2H27 2 nm production
- The Register, Rapidus funding (Feb 2026)
- Rapidus, 2 nm GAA prototype milestone
- I-Connect007, TSMC fast-tracks Arizona
- Gizmochina, Snapdragon 8 Elite Gen 5 vs Dimensity 9500 vs A19 Pro
- MacRumors, Apple A20/M6 on base N2
- Canonical, Why RVA23 is significant
- OpenROAD documentation
- Hackster, Tiny Tapeout IHP shuttle
MORE SOURCESBy topic
Process, lithography and manufacturing
- ASML, Lithography principles
- ASML, EUV lithography systems
- imec, technology articles and roadmap
- TSMC, logic technology
- IEEE International Roadmap for Devices and Systems (IRDS)
- Semiconductor Engineering
Packaging, chiplets and memory
Power and data centres
Policy and geopolitics
- US Bureau of Industry and Security (export controls)
- NIST, CHIPS for America
- European Commission, European Chips Act
- Semiconductor Industry Association
Open hardware
- RISC-V International
- The OpenROAD Project
- LibreLane
- Tiny Tapeout
- IHP Open PDK (SG13G2)
- Chipyard
- OpenTitan